【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. BL-HJC34C-TRB ● Features: ●Package Dimensions: 1. Emitted Color : Super Amber 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 3.2x1.0x1.7mm(1204) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction SINCE 1981Substance, comply ROHS standard. ● Applications: 1. Automotive : Dashboards, stop lamps, NOTES: 1.All dimensions are in millimeters (inches). turn signals. 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial electronics. 4. General use.
● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Power Dissipation Forward Current
Peak Forward Current ＊1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature
Pd
IF 30 mA
Rating 100
Unit mW
IFP 100 mA VR 5 V Topr Tstg Tsol
-25℃~80℃ -30℃~85℃ See Page6
- - -
＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.
Page 1 of 7 Ver.1.1
【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. SINCE 1981BL-HJC34C-TRB ℃) ● Electrical and optical characteristics(Ta=25 Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf =IF20mA - 2.0 2.6 V Luminous Intensity Iv =IF20mA 63 120 - mcd IR Reverse Current =µA VR5V - - 100 λp =Peak Wave Length IF20mA - 610 - nm λd= Dominant Wave Length IF20mA 600 - 610 nm Δλ Spectral Line Half-width =IF20mA - 15 - nm Veiwing Angle 2θ1/2 =IF20mA - 105 - deg ● Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
Fig.1 Relative intensity vs. wavelength
1.060 vs. ambient temperature
50Relative radiant intensityForward current (mA)400.53020100560610660020406080100Wavelength (nm)Ambient temperature Ta( C)Fig.3 Forward current vs. forward voltage503.0Fig.4 Relative luminous intensity vs. ambient temperature40Relative Luminous intensity(Normalized @20mA)2.5Forward current (mA)2.0301.520100
123451.00.50-40-200204060Forward voltage(V)AAmbient temperature Ta( C)Fig.5 Relative luminous intensity vs. forward current2.0Fig.6 Radiation diagram0102030Relative luminous intensity (@20mA)1.5Relative radiant intensity401.00.90.80.780905060701.0
0.5010203040500.50.30.10.20.40.6Forward current (mA)
Page 2 of 7 Ver.1.0
BRIGHT LED ELECTRONICS CORP. ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED1.22±0.1 1.88±0.1END START 4.0±0.11.5±0.10.3 4.0±0.12.0±0.05 NOTE: 3000 pcs PER REEL ●Package Method:(unit:mm) 12 bag/box 3000 pcs/reel Bar Code Label 245 167Aluminum Foil Bag 220 ANODE71.0±15.3±0.053.5±0.058.0±0.33.43±0.1CATHODE1.75±0.1SINCE 1981BL-HJC34C-TRB 17.2±1.213.0±0.5TRAILERLEADERFIXING TAPE215230 56 box/carton 230334 Ver.1.0 Page 3 of 7
179±1【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. BL-HJC34C-TRB ● Bin Limits Intensity Bin Limits (At 20mA)
BIN CODE Min. (mcd) Max. (mcd)
P 55.0 110.0
Q 82.0 160.0 R 120.0 240.0 S 180.0 360.0
● BIN：x
Intensity BIN CODE
SINCE 1981
Page 4 of 7 Ver.1.0
【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. BL-HJC34C-TRB ● Reliability Test Classification Test Item Reference Standard Test Conditions Result Operation Life MIL-STD-750:1026 Connect with a power If=20mA
MIL-STD-883:1005 Ta=Under room temperature 0/20
JIS-C-7021 :B-1 Test time=1,000hrs
Ta=+65℃±5℃ High
Temperature MIL-STD-202:103B RH=90%-95%
0/20 High Humidity JIS-C-7021 :B-11 Test time=240hrs
Endurance
Storage Test
High Ta=+85℃±5℃ High
MIL-STD-883:1008
Test time=1,000hrs 0/20 Temperature JIS-C-7021 :B-10
Storage
Low Ta=-35℃±5℃ Low
Temperature JIS-C-7021 :B-12 Test time=1,000hrs 0/20 Storage +25℃ ~ +85℃ ~ +25℃ Temperature MIL-STD-202:107D -35℃ ~
Cycling MIL-STD-750:1051 60min 20min 60min 20min
0/20
MIL-STD-883:1010 Test Time=5cycle
JIS-C-7021 :A-4
Thermal Shock MIL-STD-202:107D -35℃±5℃ ~+85℃±5℃
Environmental MIL-STD-750:1051 20min 20min 0/20
Test MIL-STD-883:1011 Test Time=10cycle
Preheating： Solder
MIL-STD-202:201A
140℃-160℃,within 2 minutes. Resistance 0/20 MIL-STD-750:2031
Operation heating：
JIS-C-7021 :A-1
235℃(Max.), within 10seconds. (Max.)
● Judgment criteria of failure for the reliability
SINCE 1981
Measuring items Forward voltage Reverse current Luminous intensity
Symbol Measuring conditions Judgement criteria for failure VF= ( V) IF20mA Over Ux1.2 IR=(uA) VR5V Over Ux2 Iv ( mcd ) =IF20mA Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 7
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. BL-HJC34C-TRB ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
10 SEC. MAX. 235℃ MAX. 140~160℃ 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching).
Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃
SINCE 1981● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
Temperature Temperature Preheat 120~180 sec. Time
Ver.1.0 Page 6 of 7
【深圳市登辰易科技有限公司-------电子元件选型推荐】WWW.DCY-CHINA.COMBRIGHT LED ELECTRONICS CORP. BL-HJC34C-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT SINCE 1981
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be: a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label:
BRIGHT LED LOGO
Part No.
Quantity BIN. Sealing Date
x xx xx xx Year Month Day Manufacture Location
Ver.1.0 Page 7 of 7
