Chip package and method of making and testing the

专利名称：Chip package and method of making and

testing the same

发明人：Peter Wang,Yu-Wen Huang申请号：US09766081申请日：20010119

公开号：US20010033017A1公开日：20011025

摘要：A flip-chip IC package configured for ease of testing comprises a substrate anda plurality of stiffener walls, each stiffener wall carrying an IC, wherein the stiffener wallsand ICs are fixed to the substrate with electrical continuity being established betweenthe substrate and the stiffener walls and IC's through conductive bumps (solder bumpsor conductive epoxy bumps). The substrate and the stiffener walls include test points ontheir surfaces, and also include printed electrical circuitry connecting the test points andthe conductive bumps. Some of the printed electrical circuitry is arranged to establishpaths between test points which facilitate testing of conductivity through the conductivebumps, and which facilitate functional testing of the ICs.

申请人：ANG TECHNOLOGIES INC.

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