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专利名称：METHOD FOR FABRICATING AN EMBEDDED
PATTERN USING A TRANSFER-BASEDIMPRINTING
发明人：Jun-Hyuk CHOI,Eung-Sug LEE,Ji-Hye LEE,Jun-ho JEONG,Joo-Yun JUNG,Dae-GuenCHOI,Cheol-Hyeon KIM
申请号：US14194084申请日：20140228
公开号：US20140311662A1公开日：20141023
专利附图：
摘要：In a method for fabricating an embedded pattern using a transfer-basedimprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photocurable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formedon an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-filmlayer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiatedto cure the adhesive layer. The stamp is removed.
申请人：KOREA INSTITUTE OF MACHINERY & MATERIALS
地址：Daejeon KR
国籍：KR
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