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专利名称：Method for fabricating a flexible substrate
based ball grid array (BGA) package
发明人：Kao-Yu Hsu,Shih-Chang Lee申请号：US09839212申请日：20010423公开号：US06380002B2公开日：20020430
专利附图：
摘要：A flexible substrate based BGA package mainly comprises a semiconductor chipsecurely attached onto a flexible film substrate through a nonconductive adhesive. Theflexible film substrate is formed from a flexible film having a chip attaching area for
carrying the semiconductor chip. The upper surface of the flexible film is provided with aplurality of chip connection pads, a plurality of solder pads, and at least a dummy padwhich is disposed centrally on the chip attaching area. The purpose of the dummy pad isto increase the rigidity and strength of the central part of the chip attaching area. Thechip connection pads are arranged about the periphery of the chip attaching area forelectrically connected to the semiconductor chip. The solder pads are disposed aboutthe dummy pad(s) and electrically connected to the corresponding chip connection pads.The flexible film has a plurality of through-holes formed corresponding to the solderpads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chipand the upper surface of the flexible film substrate.
申请人：ADVANCED SEMICONDUCTOR ENGINEERING, INC.
代理机构：Stevens, Davis, Miller & Mosher, LLP
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