专利内容由知识产权出版社提供
专利名称：LED package structure and method for
making the same
发明人：Bily Wang,Jonnie Chuang,Heng-Yen Lee,Hui-Yen Huang
申请号：US11085100申请日：20050322公开号：US07211882B2公开日：20070501
专利附图：
摘要：An LED package structure and a method for making the same are described.The LED package structure has at least one LED die, at least one metallic frame relating
to the LED die, and an insulative body packaging the LED die and the metallic frame. Themetallic frame has a first contact corresponding to the LED die and a second contactbeing relative to the first contact. The first and the second contacts inside the insulativebody are electrically isolated from each other. The first contact has at least one recessaround the LED die, and the second contact has at least one groove formed thereon.
申请人：Bily Wang,Jonnie Chuang,Heng-Yen Lee,Hui-Yen Huang
地址：Hsin Chu TW,Pan Chiao TW,Hsin Chu Hsien TW,Hsin Chu TW
国籍：TW,TW,TW,TW
代理机构：Rosenberg, Klein & Lee
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