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专利名称：Flip chip heat sink package and method发明人：Larry M. Mandel,Kevin M. Gertiser,Suresh K.
Chengalva,Dwadasi H.R. Sarma,David W.Zimmerman
申请号：US11583316申请日：20061019
公开号：US200700399A1公开日：20070322
专利附图：
摘要：An electronic package having enhanced heat dissipation is provided exhibitingdual conductive heat paths in opposing directions. The package includes a substrate
having electrical conductors thereon and a flip chip mounted to the substrate. The flipchip has a first surface, solder bumps on the first surface, and a second surface
oppositely disposed from the first surface. The flip chip is mounted to the substrate suchthat the solder bumps are registered with the conductors on the substrate. The packagefurther includes a stamped metal heat sink in heat transfer relationship with the secondsurface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chipcontaining a thermally conductive material.
申请人：Larry M. Mandel,Kevin M. Gertiser,Suresh K. Chengalva,Dwadasi H.R.Sarma,David W. Zimmerman
地址：Noblesville IN US,Noblesville IN US,Kokomo IN US,Kokomo IN US,Fishers IN US
国籍：US,US,US,US,US
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