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专利名称：Tungsten alloy grains, processing method
using the same, and method formanufacturing the same
发明人：Shinji Kikuhara,Hitoshi Inoue,Noboru
Uenishi,Satoshi Umemoto
申请号：US12085376申请日：20061120公开号：US08025710B2公开日：20110927
专利附图：
摘要：Provided are an ancillary material, used for shape processing, which is capable
of shortening a processing time, avoiding a reduction in quality of a shape provided to aworkpiece material, and allowing a relatively low manufacturing cost; a processingmethod using the ancillary material; and a method of manufacturing the ancillary
material. The tungsten alloy grains () comprise: tungsten of greater than or equal to 80%by mass and less than or equal to 98% by mass; nickel; at least one kind of metal
selected from the group consisting of iron, copper, and cobalt; and an inevitable impurity,a maximum diameter thereof is greater than or equal to 0.1 mm and less than or equal to5.00 mm, and a specific surface area thereof is less than or equal to 0.02 m/g. Thetungsten alloy grains (), the workpiece material (), an abrasive () are blended in a
container () and the container is rotated, thereby processing the shape of the workpiecematerial (). In the method of manufacturing the tungsten alloy grains (), a granulatedpowder is stirred at a temperature greater than or equal to a softening point of anorganic binder and thereafter, is cooled, thereby spheroidizing the granulated powder.
申请人：Shinji Kikuhara,Hitoshi Inoue,Noboru Uenishi,Satoshi Umemoto
地址：Itami JP,Itami JP,Itami JP,Itami JP
国籍：JP,JP,JP,JP
代理机构：McDermott Will & Emery LLP
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